Intel Foveros isn’t the name of a new chip, but rather a technology that will allow the chipmaker to bundle various vertical chip components, and thus improve the speed of devices without having to wait for a new chip manufacturing process to mature, like the 10nm chips that it keeps postponing.
In other words, with Foveros, Intel will be able to stack all sorts of chips on top of each other, including CPU, memory, and others, without worrying about their respective underlying manufacturing technology.
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Intel just unveiled new Foveros 3D chip stacking tech and 10nm Sunny Cove CPU originally appeared on BGR.com on Wed, 12 Dec 2018 at 18:16:29 EDT. Please see our terms for use of feeds.
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