The iPhone 6s launch event is weeks away and now we’re getting some rumors on the nitty-gritty technical specifications of Apple’s newest smartphone. According to a Chinese source familiar with Apple plans, the company will use a System in Package (SiP) architecture for the motherboard of the iPhone 6s, a feat first seen in the Apple Watch. The source, whose accuracy with Apple rumors isn’t established, posted a bunch of alleged iPhone 6s schematics on Weibo and additional details about the iPhone 6s.
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